Thermoelectrics utilizing convective heat flow

ABSTRACT

An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.

REFERENCE TO PRIOR APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.12/169,583, filed Jul. 8, 2008, which is a continuation of U.S. patentapplication Ser. No. 11/023,294, filed Dec. 27, 2004, issued as U.S.Pat. No. 7,421,845, which is a continuation of U.S. patent applicationSer. No. 10/632,235, filed on Jul. 31, 2003, issued as U.S. Pat. No.6,948,321, which is a continuation of U.S. patent application Ser. No.09/860,725, filed May 18, 2001, issued as U.S. Pat. No. 6,672,076, whichis related to, and claims the benefit of the filing date of, U.S.Provisional Patent Application No. 60/267,657, filed Feb. 9, 2001.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to improved thermoelectrics for producingheat and/or cold conditions with greater efficiency.

2. Description of the Related Art

Thermoelectric devices (TEs) utilize the properties of certain materialsto develop a thermal gradient across the material in the presence ofcurrent flow. Conventional thermoelectric devices utilize P-type andN-type semiconductors as the thermoelectric material within the device.These are physically and electrically configured in such a manner thatthey provide cooling or heating. Some fundamental equations, theories,studies, test methods and data related to TEs for cooling and heatingare described in H. J. Goldsmid, Electronic Refrigeration, Pion Ltd.,207 Brondesbury Park, London, NW2 5JN, England (1986). The most commonconfiguration used in thermoelectric devices today is illustrated inFIG. 1. Generally, P-type and N-type thermoelectric elements 102 arearrayed in a rectangular assembly 100 between two substrates 104. Acurrent, I, passes through both element types. The elements areconnected in series via copper shunts 106 soldered to the ends of theelements 102. A DC voltage 108, when applied, creates a temperaturegradient across the TE elements. TE's are commonly used to cool liquids,gases and objects. FIG. 2 for flow and FIG. 3 for an article illustrategeneral diagrams of systems using the TE assembly 100 of FIG. 1.

The basic equations for TE devices in the most common form are asfollows:

$\begin{matrix}{q_{c} = {{\alpha\;{IT}_{c}} - {\frac{1}{2}I^{2}R} - {K\;\Delta\; T}}} & (1) \\{q_{in} = {{\alpha\; I\;\Delta\; T} + {I^{2}R}}} & (2) \\{q_{h} = {{\alpha\;{IT}_{h}} + {\frac{1}{2}I^{2}R} - {K\;\Delta\; T}}} & (3)\end{matrix}$where q_(c) is the cooling rate (heat content removal rate from the coldside), q_(in) is the power input to the system, and q_(h) is the heatoutput of the system, wherein:

α=Seebeck Coefficient

I=Current Flow

T_(c)=Cold side absolute temperature

T_(h)=Hot side absolute temperature

R=Electrical resistance

K=Thermal conductance

Herein α, R and K are assumed constant, or suitably averaged values overthe appropriate temperature ranges.

Under steady state conditions the energy in and out balances:q _(c) +q _(in) =q _(h)  (4)Further, to analyze performance in the terms used within therefrigeration and heating industries, the following definitions areneeded:

$\begin{matrix}{\beta = {\frac{q_{c}}{q_{in}} = {{Cooling}\mspace{14mu}{Coefficient}\mspace{14mu}{of}\mspace{14mu}{Performance}\mspace{14mu}\left( {C\; O\; P} \right)}}} & (5) \\{\gamma = {\frac{q_{h}}{q_{in}} = {{Heating}\mspace{14mu} C\; O\; P}}} & (6)\end{matrix}$From (4);

$\begin{matrix}{{\frac{q_{c}}{q_{in}} + \frac{q_{in}}{q_{in}}} = \frac{q_{h}}{q_{in}}} & (7) \\{{\beta + 1} = \gamma} & (8)\end{matrix}$So β and γ are closely connected, and γ is always greater than β byunity.

If these equations are manipulated appropriately, conditions can befound under which either β or γ are maximum or q_(c) or q_(h) aremaximum.

If β maximum is designated by β_(m), and the COP for q_(c) maximum byβ_(c), the results are as follows:

$\begin{matrix}{\beta_{m} = {\frac{T_{c}}{\Delta\; T_{c}}\left( \frac{\sqrt{1 + {ZT}_{m}} - \frac{T_{h}}{T_{c}}}{\sqrt{1 + {ZT}_{m}} + 1} \right)}} & (9) \\{{\beta_{c} = \left( \frac{{\frac{1}{2}{ZT}_{c}^{2}} - {\Delta\; T}}{{ZT}_{c}T_{h}} \right)}{{where};}} & (10) \\{Z = {\frac{\alpha^{2}}{RK} = {\frac{\alpha^{2}\rho}{\lambda} = {{Figure}\mspace{14mu}{of}\mspace{14mu}{Merit}}}}} & (11) \\{T_{m} = \frac{T_{c} + T_{h}}{2}} & (12) \\{R = {\rho \times {{length}/{area}}}} & (13) \\{K = {\lambda + {{area}/{length}}}} & (14) \\{{\lambda = {{Material}\mspace{14mu}{Thermal}\mspace{14mu}{Conductivity}}};{and}} & (15) \\{\rho = {{Material}\mspace{14mu}{Electrical}\mspace{14mu}{Resistivity}}} & (16)\end{matrix}$

β_(m) and β_(c) depend only on Z, T_(c) and T_(h). Thus, Z is named thefigure of merit and is basic parameter that characterizes theperformance of TE systems. The magnitude of Z governs thermoelectricperformance in the geometry of FIG. 1, and in most all other geometriesand usages of thermoelectrics today.

For today's materials, thermoelectric devices have certain aerospace andsome commercial uses. However, usages are limited, because systemefficiencies are too low to compete with those of most refrigerationsystems employing freon-like fluids (such as those used inrefrigerators, car HVAC systems, building HVAC systems, home airconditioners and the like).

The limitation becomes apparent when the maximum thermoelectricefficiency from Equation 9 is compared with C_(m), the Carnot cycleefficiency (the theoretical maximum system efficiency for any coolingsystem);

$\begin{matrix}{{\frac{\beta_{m}}{C_{m}} = {\frac{\frac{T_{c}}{\Delta\; T}\left( \frac{\sqrt{1 + {ZT}_{m}} - \frac{T_{h}}{T_{c}}}{\sqrt{1 + {ZT}_{m}} + 1} \right)}{\frac{T_{c}}{\Delta\; T}} = \left( \frac{\sqrt{1 + {ZT}_{m}} - \frac{T_{h}}{T_{c}}}{\sqrt{1 + {ZT}_{m}} + 1} \right)}}{{Note},\left. {{as}\mspace{14mu} a\mspace{14mu}{check}\mspace{14mu}{if}\mspace{14mu} Z}\rightarrow\infty \right.,\left. \beta\rightarrow{C_{m}.} \right.}} & (17)\end{matrix}$

Several commercial materials have a ZT_(A) approaching 1 over somenarrow temperature range, but ZT_(A) is limited to unity in presentcommercial materials. Typical values of Z as a function of temperatureare illustrated in FIG. 4. Some experimental materials exhibit ZT_(A)=2to 4, but these are not in production. Generally, as better materialsmay become commercially available, they do not obviate the benefits ofthe present inventions.

Several configurations for thermoelectric devices are in current use inapplications where benefits from other qualities of TEs outweigh theirlow efficiency. Examples of uses are in automobile seat cooling systems,portable coolers and refrigerators, liquid cooler/heater systems forscientific applications, the cooling of electronics and fiber opticsystems and for cooling of infrared sensing system.

All of these commercial devices have in common that the heat transportwithin the device is completely constrained by the material propertiesof the TE elements. In sum, in conventional devices, conditions can berepresented by the diagram in FIG. 5. FIG. 5 depicts a thermoelectricheat exchanger 500 containing a thermoelectric device 501 sandwichedbetween a cold side heat exchanger 502 at temperature T_(C) and a hotside heat exchanger 503 at temperature T_(H). Fluid, 504 at ambienttemperature T_(A) passes through the heat exchangers 502 and 503. Theheat exchangers 502 and 503 are in good thermal contact with the coldside 505 and hot side 506 of the TE 501 respectively. When a DC currentfrom a power source (not shown) of the proper polarity is applied to theTE device 501 and fluid 504 is pumped from right to left through theheat exchangers, the fluid 504 is cooled to T_(C) and heated to T_(H).The exiting fluids 507 and 508 are assumed to be at T_(C) and T_(H)respectively as are the heat exchangers 502 and 503 and the TE device'ssurfaces 505 and 506. The temperature difference across the TE is ΔT.

SUMMARY OF THE INVENTION

None of the existing TE assemblies modify the thermal power transportwithin the TE assembly by the application of outside influences. Animproved efficiency thermoelectric device is achieved by generallysteady state convective heat transport within the device itself. Overallefficiency may be improved by designing systems wherein the TE elementsare permeable to the flow of a heat transport fluid, transport thermalenergy to a moving substance, or move the TE material itself totransport thermal energy. It should be noted that the term “heattransport” is used throughout this specification. However, heattransport encompasses thermal energy transfer of both removing heat oradding heat, depending on the application of cooling or heating.

One aspect of the present invention involves a thermoelectric systemhaving a plurality of thermoelectric elements forming a thermoelectricarray. The array has at least one first side and at least one secondside exhibiting a temperature gradient between them during operation. Inaccordance with the present invention, at least a portion of thethermoelectric array is configured to facilitate convective heattransfer through the array. To accomplish this, the array is configuredto permit flow of at least one convective medium through the at least aportion of the array to provide generally steady-state convective heattransport toward at least one side of at least a portion thethermoelectric array. The thermoelectric system may be used for cooling,heating or both cooling and heating.

In one embodiment, the convective medium flows through at least some ofthe thermoelectric elements or along the length, between and/or aroundthe thermoelectric elements. In another embodiment, the convectivemedium flows both along and through the thermoelectric elements. In onepreferred embodiment, to permit flow through the thermoelectricelements, the elements may be permeable or hollow. A combination of bothpermeable and hollow elements may also be used in an array. In oneembodiment, the elements are porous to provide the permeability. Inanother embodiment, the elements are tubular or have a honeycombstructure.

In one embodiment, flow of the convective medium occurs in a singlegeneral direction, such as from the first side to the second side orfrom a point between the first and second sides toward the first side orthe second side. In another embodiment, the convective medium flows inat least two general directions, such as from between the first side andthe second side toward the first side and toward the second side. Allsuch flows may be generally within or along the length of thethermoelectric elements (including in a spiral) or a combinationthereof.

In one particular embodiment, at least some of the thermoelectricelements form concentric tubes with convective medium flow between theconcentric tubes. In one embodiment, a first set of concentric tubesforms a thermoelectric element, with each tubular portion made fromthermoelectric material of the same conductivity type as the nexttubular portion in the set of concentric tubes. In such an embodiment, asecond set of concentric tubes is formed of a thermoelectric material ofa different conductivity type from the first set. Alternatively, thetubes may concentrically alternate between p-type thermoelectricmaterial and n-type thermoelectric material.

In another embodiment, at least part of the convective medium isthermoelectric material. The convective medium thermoelectric materialforms at least some of the thermoelectric elements. In anotherembodiment, at least part of the convective medium is thermoelectricmaterial, with the convective medium thermoelectric material forming afirst portion of at least some of the thermoelectric elements, and asolid thermoelectric material forming a second portion of the samethermoelectric elements. For example, the solid thermoelectric materialis tubular or otherwise hollow, and the convective medium thermoelectricmaterial flows through the solid thermoelectric material. Thecombination forms at least some thermoelectric elements. In oneembodiment, the convective medium is a fluid, such as air, a solid or acombination of a fluid and a solid such as a slurry.

In one configuration, a first plurality of the thermoelectric elementsare configured for convective heat transport of a first type and asecond plurality of the thermoelectric elements are configured forconvective heat transport of a second type. For example, the firstplurality of thermoelectric elements may be permeable, and the secondplurality may be thermoelectric elements made from the convectivematerial moving through the array. An example of a division of elementsis the first plurality being thermoelectric elements of a firstconductivity type and the second plurality being thermoelectric elementsof a second conductivity type. In another embodiment, at least some ofthe thermoelectric elements do not utilize convection, while others areconfigured for convection. For example, the thermoelectric elements thatdo not utilize convection are of a first conductivity type and thethermoelectric elements that utilize convection are of a secondconductivity type.

Preferably, at least a portion of the array has at least one heattransfer feature that improves heat transfer between at least some ofthe convective medium and at least some of the thermoelectric elements.For example, where the thermoelectric elements are tubular or otherwisehollow, the heat transfer feature is inside at least some of thethermoelectric elements. Where the convective medium flows along theoutside of the thermoelectric elements, the heat transfer feature isbetween at least some of the thermoelectric elements. An example of suchheat transfer feature is a convective medium flow disturbing feature.

Another aspect of the present invention involves a method of improvingefficiency in a thermoelectric system having a plurality ofthermoelectric elements forming a thermoelectric array. Thethermoelectric array has at least one first side and at least one secondside exhibiting a temperature gradient between them during operation ofthe thermoelectric array. The method involves actively convectingthermal power through at least a portion of the array in a generallysteady-state manner. Generally, the step of convecting thermal powerinvolves flowing at least one convective medium through at least aportion of the thermoelectric array. The convective medium may be fluid,solid or a combination of fluid and solid. The method may be used forcooling, for heating or for both cooling and heating applications.

In one advantageous embodiment, the step of flowing involves flowing atleast some of the convective medium through at least some of thethermoelectric elements. For example, the thermoelectric elements areconstructed to be permeable or porous. The thermoelectric elements mayalso be hollow, such as having a tubular or honeycomb configuration.

In one embodiment, the step of flowing involves flowing the convectivemedium generally through the array from the first side to the secondside, or generally from between the first side and the second sidetoward the first side or toward the second side. In another embodiment,the step of flowing involves flowing the convective medium in at leasttwo general directions, such as flowing the convective medium generallyfrom between the first side and the second side toward the first sideand toward the second side. The flow may be through at least some of thethermoelectric elements, along at least some of the thermoelectricelements, through some thermoelectric elements and along others, or anycombination.

In one embodiment, the thermoelectric material forms at least a portionof the convective medium. In this embodiment, the method furtherinvolves the step of forming a first portion of at least some of thethermoelectric elements with the convective material. As a furtheralternative, the method in this configuration further involves the stepof flowing the convective medium thermoelectric material through otherthermoelectric material in a hollow form, the combination of the flowingconvective medium thermoelectric material and the thermoelectricmaterial in a hollow form forming the at least some thermoelectricelements.

In one embodiment of the method, the step of actively convectinginvolves convecting heat through a first portion of the array in a firstmanner and through a second portion of the array in a second manner. Forexample, the first portion of the array is a plurality of thermoelectricelements of a first conductivity type and the second portion of thearray is a plurality are thermoelectric elements of a secondconductivity type.

Yet another aspect of the present invention involves a thermoelectricsystem with a thermoelectric array having a plurality of thermoelectricelements and having at least one first side and at least one secondside. The first and second sides exhibit a temperature gradient betweenthem during operation. At least a portion of the thermoelectric array isconfigured to permit flow of at least one convective medium through theat least a portion of the array to provide generally steady-stateconvective heat transport toward at least one side of at least a portionthe thermoelectric array. According to this aspect of the presentinvention, the system has at least one control system, with at least onecontroller, at least one input coupled to the controller, and at leastone output coupled to the controller and to the thermoelectric array.The output is advantageously controllable by the controller to modify atleast one characteristic of at least a portion of the thermoelectricarray. The at least one input may be at least one external sensor, atleast one sensor internal to the thermoelectric array, or a userselectable input, such as a switch or a thermostat, or any combinationof these. In one embodiment, the controller operates in accordance withat least one algorithm responsive to the at least one input to controlthe at least one output.

Preferably, the at least one characteristic impacts the convective heattransport, and the adjustment improves efficiency or power output byadjusting the characteristic. For example, the control system variesmovement of at least some of the convective medium in response to theinput. In another embodiment, the control system adjusts othercharacteristics, such as the current through at least some of thethermoelectric elements. The adjustment of characteristics other thanthe convection may be alone or in combination with adjustment of theconvection.

These and other aspects are described in more detail below inconjunction with the following figures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B depict a conventional thermoelectric device;

FIG. 2 depicts a conventional thermoelectric device in a conventionalfluid heating or cooling application;

FIG. 3 depicts a conventional thermoelectric element for use in coolinga material or component;

FIG. 4 depicts an efficiency measure of various thermoelectricmaterials;

FIG. 5 illustrates a generalized conditions diagram of conventionalthermoelectric devices;

FIG. 6 illustrates a generalized block diagram of a thermoelectricsystem;

FIGS. 7A and 7B depict an embodiment of a conventional thermoelectricsystem;

FIGS. 8A and 8B depict an embodiment of a thermoelectric systememploying convective heat transport in accordance with the presentinvention;

FIGS. 9A and 9B depict another embodiment of a thermoelectric system inaccordance with the present invention using a liquid thermoelectricmaterial for convective heat transport;

FIG. 10 depicts a detailed illustration of a portion of the TE elementarray showing a tubular TE element;

FIG. 11 depicts a detailed illustration of a portion of the TE elementarray showing a tubular TE element with a heat transfer feature;

FIGS. 12A and 12B depict a detailed illustration of a portion of the TEelement array showing a TE element composed of nested concentric tubes;

FIG. 13 depicts a detailed illustration of a portion of the TE elementarray showing convection along the length of the TE elements;

FIGS. 14A and 14B depict a detailed illustration of a portion of the TEelement array showing convection along the length of the TE elementswith additional mixing created by a heat transfer feature;

FIGS. 15A and 15B depict a detailed illustration of a portion of the TEelement array showing a TE element with a honeycomb structure;

FIGS. 16 A and 16B depict another embodiment of a thermoelectric systemin accordance with the present invention using a solid material as theconvective heat transfer medium;

FIG. 17 depicts an existing device used to both heat and cool that canbe improved in its efficiency by convective heat transfer in accordancewith the present invention;

FIG. 18 depicts an embodiment with convective heat transfer of animprovement of the device of FIG. 17 in accordance with the presentinvention;

FIG. 19 illustrates a control system for use with thermoelectric systemsof the present invention; and

FIGS. 20A-20D illustrate several variations of thermoelectric elementsconfigured in a manner to vary their thermal and electricalcharacteristics.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The invention is introduced using examples and particular embodimentsfor descriptive purposes. A variety of examples are presented toillustrate how various configurations can be employed to achieve thedesired improvements. In accordance with the present invention, theparticular embodiments are only illustrative and not intended in any wayto restrict the inventions presented. In addition, it should beunderstood that the terms cooling side, heating side, cold side, hotside, cooler side and hotter side and the like do not indicate anyparticular temperature, but are relative terms. For example, the “hot,”“heating” or “hotter” side of a thermoelectric element or array may beat ambient temperature, with the “cold,” “cooling” or “cooler” side at acooler temperature than ambient. Conversely, the “cold,” “cooling” or“cooler” side may be at ambient with the “hot,” “heating” or “hotter”side at a higher temperature than ambient. Thus, the terms are relativeto each other to indicate that one side of the thermoelectric is at ahigher or lower temperature than the counter-designated side. Similarly,the terms “cooling side” and “heating side” are not intended todesignate the particular use for a thermoelectric system in any givenapplication.

A block diagram of an overall TE system 600 is shown in FIG. 6. Athermoelectric assembly 601 with hot side 603 and cool side 604 iselectrically connected to a power source 602. The thermoelectricassembly 601 is in good thermal contact with a hot side heat exchanger607 on the hot side 603 and with a cool side heat exchanger 608 on thecool side 604. Equipped with suitable ducts or pipes, sources of fluid,605 for the hot side 603 and 606 for the cool side 604, send theirfluids through their respective heat exchangers 607 and 608. Heatedfluid 609 and cooled fluid 610 exit the system at the right in FIG. 6.For certain applications (with examples given below) one of the heatexchangers 607 or 608 may be replaced with a heat sink, therebyeliminating the need for a fluid source or fluid on that side.

The present invention is based on the concept that the conductive/lossheat transport terms in Equations 1 and 3 which contain K and R, can bemodified by the use of steady state convection through the array so asto diminish their overall effect on system performance. How this can beaccomplished can be understood by first looking at the equations thatgovern heat generation and flow in a conventional TE. For simplicity,assume that material properties do not change with current andtemperature, heat and current flow are one-dimensional, and thatconditions do not vary with time. For this case:

$\begin{matrix}{{{{- K}\frac{\mathbb{d}^{2}T}{\mathbb{d}x^{2}}} = \frac{I^{2}R}{L}}{{where};}} & (18) \\{{I^{2}{R/L}} = {{the}\mspace{14mu}{resistive}\mspace{14mu}{heat}\mspace{14mu}{generation}\mspace{14mu}{per}\mspace{14mu}{unit}\mspace{14mu}{{length}.}}} & (19)\end{matrix}$

For TE systems with typical boundary conditions, Equation 18 hasEquations 1 and 3 as solutions. From Equation 3, the heating source term(αIT_(h)) contributes to heat output at the hot side as does ½I²R, thatis, one-half of the TE element resistive heating. Note that the otherone half goes out the cold side, as seen in Equation 1 (where it has theminus sign since it subtracts from cooling). Further the heat output atthe hot side is reduced by the conductive loss, KΔT. Thus, Equation 3shows that q_(h) is reduced by KΔT and ½ of the I²R heating within theTE elements.

Consider a comparison between conventional thermoelectric heating, andsystems that employ steady state convective heat transport. Ifconvection is added and the other assumptions are retained, Equation 18becomes:

$\begin{matrix}{{{- K}\frac{\mathbb{d}^{2}T}{\mathbb{d}x^{2}}} = {{{- {CpM}}\frac{\mathbb{d}T}{\mathbb{d}x}} + \frac{I^{2}R}{L}}} & (20) \\{{where};} & \; \\{{CpM} = {{Thermal}\mspace{14mu}{mass}\mspace{14mu}{of}\mspace{14mu}{fluid}\mspace{14mu}{transported}\mspace{14mu}{per}\mspace{14mu}{unit}\mspace{14mu}{{time}.}}} & (21)\end{matrix}$

The extra term leads to a new parameter δ, which is the ratio ofconvective to conductive heat transport. If it is assumed that theconvective transport goes toward the hot end in the heating mode and thecold end in cooling, and appropriate boundary conditions are used, thesolutions to Equation 20 for cooling and heating become;

$\begin{matrix}{q_{c} = {{\alpha\;{IT}_{c}} - {\frac{\xi(\delta)}{2}I^{2}R} - {{K(\delta)}\Delta\; T}}} & (21) \\{{q_{h} = {{\alpha\;{IT}_{h}} + {\frac{\xi(\delta)}{2}I^{2}R} - {{K(\delta)}\Delta\; T}}}{{where};}} & (22) \\{\delta = \frac{CpM}{K}} & (23) \\{{\xi(\delta)} = {\left( \frac{2}{\delta} \right)\frac{\left( {\delta + {\mathbb{e}}^{- \delta} - 1} \right)}{\left( {1 - {\mathbb{e}}^{- \delta}} \right)}}} & (24) \\{{K(\delta)} = {K\left( \frac{{\delta\mathbb{e}}^{- \delta}}{1 - {\mathbb{e}}^{- \delta}} \right)}} & (25)\end{matrix}$

Notice that K(δ) is a function of δ and approaches the conductive valueK for δ→0. Also, for δ>0 a larger portion of the I²R heating istransported to the hot (in heating) or cold (in cooling) end. The termξ(δ)/2→½ when δ→0 as expected. Approximate values for ξ(δ) and K(δ)/Kare given in Table 1. Note from Equation 2, that q_(in) is not a directfunction of δ. Also, a condition is imposed on δ by the energy balancerequirement that CpMΔT (the power required to heat or cool the fluid)cannot exceed q_(h) (the heat generated by the TE) or q_(c) (the heatabsorbed by the TE). Typically, this restricts δ to less than 5. Actualimprovement in COP for allowable values for δ ranges up to about 100%.Similarly, q_(c) improves by up to about 50%.

TABLE 1 δ ξ(δ) K(δ)/K 0 1.000 1.000 .1 1.017 .951 .2 1.033 .903 .5 1.083.771 1.0 1.164 .582 2.0 1.313 .313 5.0 1.614 .034

In the heating mode, convection enhances performance in two ways: first,a larger fraction of the heating is transported to the hot end, sinceξ(δ)>1 for δ>0, and second, K(δ)<K for δ>0 so that less thermal power islost to conduction.

The situation is more complex in cooling. To best understand coolingoperation, consider the case where the waste side is a heat sink atambient temperature. The convective medium enters at the waste side andexits out the cold side. Thus the TE elements extract heat content fromthe medium thereby cooling it as it moves toward the cold side. Theparameter K(δ)<K for δ>0 as in heating, so the conduction termdiminishes with increased δ as in heating. However this advantage ispartially offset by an increase in the fraction of heating transportedto the cold end by I²R heating. Nevertheless, the change in K(δ) can begreater than ξ(δ), for increasing δ, so that under most conditions q_(c)increases with increased convection. The effect can be enhanced furtherby a decrease of the current I to a minimum optimum value from a highervalue. While the thermal cooling decreases proportionally to thereduction in I, the resistive heating term decreases as the square of Iand hence more rapidly. such current reduction can be utilized to offsetfurther the increase in the resistive heating term from convection. Thenet result is that under many important practical operating conditions,cooling efficiency increases. Calculations for specific TE systems arerequired to determine conditions that exhibit gain when utilizingconvective transport.

The basic concept of improvement in efficiency by steady stateconvective heat transport through the array is explained using FIGS. 7and 8. FIG. 7A depicts a conventional TE system 700 without convectiveheat transport. A TE element array 701 is constructed with a hot sidesubstrate 702 and a cool side substrate 703 sandwiching a plurality ofTE elements 704, electrically connected in series by circuitry 705. Apower source 710 is applied across the TE array 701. The TE elements 704and the circuitry 705 are in good thermal contact with each other andwith the hot and cool side substrates 702 and 703. On the cool side, aheat sink 706 is in good thermal contact with the cool side substrate703. From the standpoint of this TE system, the heat sink 706 iseffectively infinite. On the hot side, a heat exchanger 707 is in goodthermal contact with the hot side substrate 702. In this embodiment, theheat exchanger is a fin assembly. A fan 708 is a source of air 709 forthe heat exchanger 707. When operating, electrical power from the powersource 710 passes current through the TE elements 704 and throughcircuitry 705 on the substrates 702 and 703. The TE elements 704 areconnected so that the hot side substrate 702 becomes warm and heats theheat exchanger fins 707. The air 709 is pumped through fins (notexplicitly shown) of the heat exchanger 707 by the fan 708 entering atthe left at ambient temperature T_(A) and exiting at the right attemperature T_(H).

An enlarged view of section B-B of the assembly 701 is depicted in FIG.7B with a corresponding temperature profile (not to scale), 711 withinthe TE elements 704. The location x=0 is the interface between the TEelements 704 and circuitry 705 on the cold side substrate 703.Similarly, x=L is interface between the TE elements 704 and circuitry705 on the hot side substrate 702. The temperature 711 is T_(A) at x=0and T_(H) at x=L.

FIG. 8A depicts one embodiment of a TE system 820 in accordance with thepresent invention. This TE system 820 is similar to the TE system 700but has convective heat transport. The TE system 820 has many partscorresponding to those of the TE system 700 shown in FIG. 7A which arelabeled with the same reference numerals.

The TE system 820 has a TE element array 821 that has a permeable orporous thermoelectric elements 824, a manifold 828 within a cold sideheat sink 826, holes 827 which extend from the manifold 828 through thecold side substrate 823 and through circuitry 825. Similar holes 835extend from a heat exchanger manifold 829 through the hot side substrate822 and the hot side circuitry 825. Preferably, between the TE elements824 is a thermally and electrically insulating material 830. In thepresent embodiment, air (or other fluid) 709 is ducted by the manifold828 through the porous TE element 824. The air 709 is then ducted outthrough a manifold 829. In the figure, the air 709 enters at the lowerleft at temperature T_(A) and exits at the upper right at temperatureT_(H). Preferably, the air flow rate and the porosity of the TE elementsare matched so that the air and TE element temperatures are nearly inequilibrium at any position within the active area of the elements. Afan 708 controls the flow. As the air 709 passes through the TE elements824 it absorbs heat content from the TE elements 824 and carries theheat generated by the TE system 820 through the manifold 829.

Assuming α, R and K are the same for TE systems 700 and 820, themovement of the air 709 in FIG. 8 causes three profound changes. First,as the TE elements 824 are heated by the I²R (resistive heating), aportion of the heat is convected toward the hot side and so a fractionof I²R heating larger than ½I²R will move to the hot side. As a result,more of the I²R heating will contribute to the q_(h) term of Equation 3resulting in more heat transfer to the heated fluid. Second, theconduction loss at x=0 is lower because the slope of the temperatureprofile is less at x=0. Third, the air exiting the system at x=L carriesup to all of the heat content q_(h). In some cases of interest, the aircarries all the heat content, and when it does, efficiency gain isgreatest.

FIG. 8B illustrates an enlargement of a portion along section 8B-8B ofthe TE array assembly 821 shown alongside the graph of temperature vs.position along the length of a TE element 824 for this configuration.Air flow 709 through the TE elements 824 is depicted. A correspondingtemperature profile 831 of both the air 709 and the porous elements 824(preferably assumed to be near equilibrium or equilibrium at allpositions, x) is shown to the right. The temperature profile 831 in thegraph in FIG. 8B shows that while the temperature reaches T_(h) at L,just like the profile 711 for the TE system 700 in FIG. 7B, its shapefor TE system 820 has greater curvature with less temperature rise nearx=0. Generally, the TE system 820 offers greater efficiency, and hencehas lower power consumption and operating costs to achieve a temperatureT_(H) for the same amount of air flow as compared to the system in FIG.7A.

It should be noted that for the embodiment of FIG. 8, as well as otherembodiments herein, although a single hotter side substrate and singlecooler side substrate are generally depicted, a TE system in accordancewith the present invention may stack TE arrays, or otherwise havemultiple colder side substrates and multiple hotter side substrates.

Another embodiment of a TE system 900 that employs convective heattransport in accordance with the present invention is shown in FIG. 9.This embodiment has a TE array 921 made up of TE elements 902, hot andcold side substrates 922, 923, circuitry 925, heat sink 906, heatexchanger 907, pumps 909, and holes 927, 931 through the circuitry andsubstrates 922, 923. Two heat transfer fluids 911, 912 arethermoelectric materials that constitute the TE elements 902. The twoheat transfer fluids, N-type 912 and P-type 911, occupy the spacebetween the cold side substrate 923 and the hot side substrate 922. Heattransfer fluids 911, 912 are also contained within heat exchangers 908that are connected to two finned tube arrays which are electricallyinsulated from one another. There are two sets of channels 910 in thecool side heat sink 906.

The heat transfer fluids 911, 912 consist of N- and P-type liquid TEmaterials. One example of liquid TE materials is a mixture of Thalliumand Tellurium (p-type) at temperatures (above room temperature) where itbecomes liquid, and a mixture of mercury/rubidium (n-type). Some suchmaterials are described by A. F. Loffe, in Semiconductor ThermalElements, and Thermoelectric Cooling, Infosearch, London, 1957. Anotherexample is P-type Bismuth Telluride slurried in mercury and N-typeBismuth Telluride slurried in mercury.

FIG. 9B illustrates an enlarged view of a portion of the TE array 921.As depicted in FIG. 9B, the heat transfer fluids at the point at whichthey form TE elements 902 are contained within sleeves 924.Advantageously, the sleeves 924 are electrically insulative and have athermal conductivity that is low enough such that the sleeves' 824 heatconduction from the hot side 922 to the cold side 923 is substantiallynegligible compared to KΔT where K is the thermal conductance of the TEelement 902. In one embodiment, the sleeves 924 are formed of solidthermoelectric material.

The pumps 909 cause the heat transfer fluids to move through thechannels 910, forming the thermoelectric elements 902 as they flowbetween the substrates 922, 923, and to flow through the finned heattubes 908. In the present embodiment, the flow of the heat transferfluids 911, 912 convects heat from the cool side heat sink 906 to thehot side heat exchanger 907 under the action of the pumps 909. Withinthe hot side heat exchanger 907, heat is transferred to air or gas 932entering at the left at temperature T_(A), and exiting at the right attemperature T_(H). The two pumps 909 and two separate finned tubes 908carry, electrically isolated from one another, the two heat transferfluids 911, 912. The heat transfer fluids' 911, 912 paths each areconstructed to have high electrical resistance between the severalconnected fluid paths so that the required voltages can be appliedacross the TE elements 902 and the circuitry 925, without significantparasitic losses.

It should be noted that different portions of the thermoelectric arraymay be configured with different types of convective heat transfer, orno convective heat transfer. For example, in one embodiment, the heattransfer mechanism of FIGS. 8 and 9 may be combined, using the steadystate convection of FIG. 8 for a portion of the array and the steadystate convection of FIG. 9 for another portion of the array. In oneembodiment, one configuration is used for the n-type thermoelectricelements and another configuration is used for the p-type thermoelectricelements.

FIGS. 10 through 15 depict different embodiments of TE elements that canbe used in place of the porous elements described in FIG. 8. Preferably,with these embodiments, the fluid and solid elements are designed tohave minimal temperature differences between them and the convectivemedium at any point within the TE elements.

FIG. 10 shows a portion 1001 of a TE element array for use in a systemsuch as that shown in FIG. 8 with a hot side substrate 1002, a cold sidesubstrate 1003, circuitry 1006, holes 1005 through the substrates andcircuitry, and a plurality of hollow, solid TE elements 1004. The heattransfer liquid (which may be liquid TE material or another non-TEmaterial fluid) enters holes in the cool side at temperature T_(A) andexits the hot side at temperature T_(H). The TE element 1004 (not toscale) has a large enough interior surface area compared to the interiorhole 1007 diameter and its wall thickness so that there is minimaltemperature difference between the element wall and the convectivemedium in the internal hole 1007 at any selected position along thedirection of fluid flow (e.g., as indicated by the line 1008).

FIG. 11 shows a portion 1101 of a thermoelectric array like that of FIG.10 with a hot side substrate 1102, a cold side substrate 1103, circuitry1106, holes 1105 through the substrates and circuitry, and a pluralityof hollow TE elements 1104. FIG. 11 illustrates a heat transfer feature.One particular example is a flow-disturbing feature to mix the flow,such as spiral vanes 1108 placed inside the hollow (e.g., tubular) TEelements 1104. The vanes serve to spin and mix the heat transfer fluid1109 thereby increasing the heat transfer from the TE elements 1104 tothe heat transfer fluid 1109. Another example of a flow-disturbingfeature is grooves, like rifling on a gun, placed on the inside of thehollow TE elements 1104. Any feature that improves heat transfer betweenthe thermoelectric elements and the convective medium as it flows pastor through the TE elements, provided that it does not greatly inhibitflow, will suffice.

FIGS. 12A and 12B depict a construction of a TE array 1201 in which theTE elements form concentric tubes 1214-1216. FIG. 12A depicts a top viewof the thermoelectric elements 1214, 1215 and 1216 only. FIG. 12B showsa cross-section through B-B of FIG. 12A, and adds the substrates 1202,1203 and circuitry 1206 along with fluid flow from bottom to top. The TEarray 1201 has hot and cool side substrates 1202 and 1203, circuitry1206, and the concentric tubes 1214, 1215, and 1216. The holes in thecircuitry and substrate 1205 are aligned with the annular gaps 1217between the concentric tubes 1214, 1215, 1216. Heat transfer fluid 1218passes through the annular gaps 1217. In FIG. 12, three concentric tubesare shown as an example. In this example, the tubes may alternateconcentrically between p-type and n-type. Alternatively, the concentrictubes may each be of the same conductivity type, with the counter-typethermoelectric elements formed of another set of concentric tubes of theopposite type of thermoelectric material. The number of concentric tubescan be any practical number. Furthermore, the heat transfer fluid 1218can also be directed along the outside diameter of the largest tube.Again, the tubes 1214, 1215, and 1216 are designed to be close tothermal equilibrium with the fluid 1218 along any line 1219 parallel toand between the substrates 1202 and 1203.

FIG. 13 shows a TE array 1301 constructed with a plurality of solid TEelements 1304 around which heat transfer fluid 1307 flows. The TE array1301 is constructed like those described above having hot and cool sidesubstrates 1302 and 1303, circuitry 1306 and holes 1305 in the circuitryand substrates to allow the heat transfer fluid (convective medium) 1307to flow through the array.

FIGS. 14A and 14B show a portion of a TE array 1401 constructed likethat of FIG. 13 with the addition of a heat transfer feature. In thisembodiment, the heat transfer feature is between the TE elements 1304.In this Figure, the heat transfer feature is a flow-disturbing feature,such as vanes 1407. One example is depicted in FIG. 14B. The vanes 1407serve to duct the heat transfer fluid 1408 in a spiral path therebyincreasing the heat transfer. Thermal insulation 1409 can be placedaround the space that encloses vanes 1407 to further duct the fluid 1408and enhance heat transfer. As with FIG. 11, other features that improveheat transfer between the thermoelectric elements and the convectivemedium are possible.

FIG. 15 shows a portion of a TE array 1501 constructed similar to thatof FIG. 10 with hot and cold side substrates 1002 and 1003, circuitry1006 but with the TE elements 1504 allowing fluid to move through themby constructing them with a honeycomb configuration as depicted in FIG.15B. The large surface area of the honeycomb increases the heat transferto the heat transfer fluid 1505.

In the embodiments described above in which the heat exchanger isdescribed, fins and finned tubes have been used as examples. Many otherheat exchanger designs can be used, such as those described in Kays,William M., and London, A. L., Compact Heat Exchangers, McGraw-Hill,1984.

In the embodiment described in FIG. 9, the heat transfer fluid is liquidTE material while in the other embodiments, the heat transfer fluid issome other fluid such as air or water, or a slurry of TE materials andsuitable media. Furthermore, a solid heat transfer material can also beemployed. FIGS. 16A and 16B show one embodiment using a solid heattransfer material. FIG. 16A shows a plan view of the apparatus. FIG. 16Bis sectional view from 16B-16B of FIG. 16A. A TE array 1601 isconstructed with TE elements 1605 that are connected in series withcircuitry 1606. Voltage, V is applied between the ends of the seriescircuit. A plurality of TE elements 1605 are arrayed with spaces betweenthem. Filling each space is a heat transfer ring 1604 that has aplurality of circumferential ridges 1608 (like teeth) that fit withinthe space between the TE elements 1605. The remaining space between theTE elements 1605 and the heat transfer ring's ridges 1608 is filled witha thermally conducting lubricant 1607. The heat transfer ring 1604 ismade from a material such as a metal-epoxy composite that has highthermal conductivity axially and radially, and low thermal conductivitycircumferentially. As viewed in FIG. 16A, the ring 1604 rotates aboutits center in a counter-clockwise direction. A duct 1609 with inlet 1602and outlet 1603 for the fluid to be heated 1610 surrounds that portionof the heat transfer ring 1604 that is not in thermal contact with theTE array 1601. It thereby creates a barrier so that the fluid 1610 isprevented from passing through the TE array region 1611. The fluid 1610at temperature T_(A) enters the duct 1609 at inlet 1602 and flowsclockwise in FIG. 16A around the heat transfer ring exiting at theoutlet 1603 at temperature T_(H). Thus the ring 1604 and duct 1609 forma reverse flow heat exchanger. As the heat transfer ring 1604 rotatescounter-clockwise, it is heated in the region of the TE array 1601. Theflow rate of the fluid 1610 and the rotational rate of the heat transferring 1604 are such that as the fluid 1610 flows clockwise, heat istransferred from the heat transfer ring 1604 to the fluid 1610 therebycooling back to a temperature near T_(A), that portion of the heattransfer ring 1604 that is about to re-enter the TE array 1601. A heatpipe 1612 convects heat from an external heat sink to the cold side ofthe TE elements 1605.

With the configurations of FIGS. 11-16, it is preferable for efficiencygains that there is little or no temperature difference between theconvective medium passing between the thermoelectric elements and thetemperature of the thermoelectrics at any location generallyperpendicular to the direction of flow. Preferably, the thermalconductivity of the added components in total results in a sufficientlysmall increase in TE element thermal conductivity so that the loss inperformance from these sources is acceptable. This provides for improvedsystem efficiency.

The previous concepts that improve heating can be modified to improvecooling as well. As noted above, while the equation for cooling (21) issimilar to that for heating (22), the minus sign in the I²R termrestricts conditions for which improvement occurs and limits itsmagnitude.

Based on theoretical analysis that parallels that of Goldsmid, theoptimum theoretical COP, φ_(cm)(δ) can be written as;

$\begin{matrix}{{\phi_{cm}(\delta)} = {\left( \frac{T_{c}}{\Delta\; T} \right)\left( \frac{\sqrt{1 + {{Z(\delta)}{T(\delta)}}} - 1 - {{\xi(\delta)}\frac{\Delta\; T}{T_{c}}}}{\sqrt{1 + {{Z(\delta)}{T(\delta)}} + 1}} \right)}} & (26) \\{{{I(\delta)}_{opt} = {\frac{\alpha\; T_{c}}{R}\left( \frac{\sqrt{1 + {{Z(\delta)}T_{\xi}}} - 1}{\sqrt{1 + {{Z(\delta)}{T(\delta)}}} + 1} \right)}}{{where};}} & (27) \\{{Z(\delta)} = \frac{\alpha^{2}}{{RK}(\delta)}} & (28) \\{T_{\xi} = {T_{c} + {\frac{\xi(\delta)}{2}\Delta\; T}}} & (29)\end{matrix}$

Similarly, the COP, φ_(cc)(δ) for maximum cooling q_(c)(δ) can bewritten as;

$\begin{matrix}{\phi_{cc} = \frac{{{Z(\delta)}T_{C}^{2}} - {\Delta\; T}}{{Z(\delta)}T_{C}T_{H}}} & (30)\end{matrix}$

If, in Equations 26 and 30, δ goes to zero the results become Equations9 and 10, so the difference is due to δ, as expected.

As noted above, δ is restricted by the condition that the cooling powerq_(c), must equal or be greater than CpMΔT_(c), the cooling powerrequired by the fluid flow. This allows efficiency gains of up to about50% in most circumstances of practical importance, when compared totraditional designs. The configurations for cooling can be similar tothat for heating versions depicted in FIGS. 8B through 15. Note that theelectrons flow in the opposite direction to that of heating, or thethermal power is extracted from the opposite (cold) side.

Generally, the TE system generates both cold and hot side thermal power.In heating, the cold side waste power must be dealt with, and in coolingthe hot waste power must be handled. For example, in AmerigonIncorporated's climate control seat (CCS) system, air from a fan issplit so that a fraction, m goes to the side which cools or heats theoccupant of the seat and the balance, 1−m, is ducted away way from theseat and occupant.

Such a CCS TE system 1700 is shown in FIG. 17. Herein the air 1709 thatis cooled (or heated) and supplied to the occupant is identified as themain side and the air 1710 that contains the thermal power to be ductedaway is the waste side. In this design, a TE assembly 1701 similar tothat shown in FIG. 1 is in good thermal contact with main side copperfins 1702 and waste side copper fins 1703. Voltage V 1711 is applied tothe TE assembly 1701. The polarity of the voltage 1711 determineswhether the main side is cooled or heated. A fan 1704 forces air 1712 atambient temperature T_(A) into the inlet duct 1705. The geometry of theTE system 1700 divides the total flow to pass a fraction of it throughthe main side fins 1702 to the main exit duct 1706 and a somewhat largerfraction through the waste side fins 1703 to the waste exit duct 1707.When operating in the cooling mode, the main side air 1709 is cooled andthe waste side air 1710 is heated. The housing 1708 is constructed so asto minimize both thermal losses to the environment and heat transferbetween the main and waste sides.

The efficiency and ΔT of the TE system 1700 depicted in FIG. 17increases by using convective heat transport in accordance with thepresent invention for example as shown by TE system 1800 in FIG. 18. InFIG. 18, a TE assembly 1801 is constructed with a main side substrate1802 and a waste side substrate 1803 sandwiching a plurality ofelongated TE elements 1804. TE elements may be porous, or have otherconfigurations described above which permits fluid to flow through theTE element. Other configurations shown above may also be applicable withslight variations. The TE elements 1804 are connected by circuitry 1805.Voltage V 1812 is applied to the TE assembly 1801. The polarity of thevoltage 1812 determines whether the main side is cooled or heated. A fan1806 forces air 1813 at ambient temperature T_(A) into the inlet 1807.The air from the inlet 1807 is introduced circumferentially to the TEarray 1801 near the centers 1808 of the porous TE elements 1804, a pointon the TE elements 1804 that is near ambient temperature T_(A). Aportion of the air 1814 is ducted by a manifold and air passage 1809through space between the TE elements 1804 and is collected and exits atthe main side outlet 1810 and the remaining portion of the air 1815 isducted to the waste side outlet 1811. COP and mass flow fraction on themain side can be 30-70% larger than with the traditional design.

The embodiment of FIG. 18 could also provide for flow from a point atabout ambient temperature between the colder side and the hotter sidealong the outside of the thermoelectric elements rather than or inaddition to flow through the thermoelectric elements. In other words, aconvective medium may flow from a point between the hotter side and thecolder side along the thermoelectric elements toward both the hotterside and the cooler side. Similarly, in the embodiment of FIG. 18, withthe convective material entering from between the hotter side and thecolder side, flow could be toward one or the other sides.

The embodiments described above as examples may be connected to acontrol system for the purpose of adjusting system performance based on,for example, user inputs, external conditions, or conditions within thesystem itself. These conditions, some or all of which may be present,include external temperatures or flows, internal temperatures or flows,and user selectable inputs to manually achieve predetermined ordynamically determined performance of the system. FIG. 19 depicts, as ablock diagram, one example of such a control system 1900.

The control system has a control circuit 1901 coupled to user selectableinputs 1902, a user interface 1903, external sensors 1904, internalsensors 1905, TE element power regulators 1906, actuators 1907 and flowcontrols 1908. Any one or more of the items connected to the controlcircuit 1901 may be provided or not provided in any given design.Generally, the control circuit 1901 is an electronic circuit that can beas simple as a wiring harness or as complex as a programmablemicro-controller circuit with many inputs and outputs. Virtually anymanual input device may be connected; for example these inputs can besimple on/off switches, multi-position switches, potentiometers,keyboards or other user selectable devices. A user interface 1903employing for example, a display, indicator lights, or audible promptscan be provided for the user selectable or configurable inputs.

External conditions are sensed by external sensors 1904. These sensorsare, for example, sensors of ambient conditions, or inlet or outletfluid temperatures. Internal conditions are sensed by sensors andinclude, for example, TE currents, TE voltages, fluid flow rates, orinternal fluid temperatures.

Advantageously, through the user interface 1903, the conditionsmonitored or actuation levels for the conditions monitored via thesensors 1902 and 1904 can be modified to customize the TE system for itsparticular application or the particular condition to which it issubjected at any given time. The sensors 1902, 1904, and 1905 aremonitored by control circuitry 1901 which, using hardware or softwarerelationships (whose nature depends upon the application), causesadjustments to be made to the system in accordance with the sensorinputs. When system complexity warrants it, an algorithm may be employedwithin the control circuitry or its software.

The control circuitry 1901 can provide electrical outputs to a varietyof devices that can adjust for example, power to the TE elements,resistance of TE elements, or flow of fluids. Power to the TE elementsmay be varied for all TE elements at once, or individually. For example,voltage or current regulators 1906 may be utilized. TE resistances maybe adjusted by means of mechanical actuators 1907. Flow rates may beadjusted by means of for example, vanes, valves, pump speeds, or fanspeeds 1908. It should be noted that the control system may also be assimple as a user adjusting a switch or thermostat in response to atemperature sensed by the user.

An advantage of this type of system is that it permits the thermal powergenerated by the TE system to be varied as desired to achieveimprovement in efficiency or power output by taking into account notonly expected user preferences and conditions, but also the changes inthem that occur from time to time. The devices used to accomplish thesensory inputs, the user interface, the flow controls and the powerregulation can be via commercially available devices, straightforwardcustomization of such devices, or special custom components.

Examples of ways to adjust the resistances of liquid or slurried TEelements are depicted in FIGS. 20A through 20D. These examples may beused in the construction of the embodiment described above in FIG. 9.Advantages of changing the resistance are described in co-pending patentapplication Ser. No. 09/844,818, file on Apr. 27, 2001 entitled ImprovedEfficiency Thermoelectrics Utilizing Thermal Isolation, by the sameinventor, which is incorporated by reference herein.

FIG. 20A shows a portion of a TE element array 2001 in which theresistance of the TE elements 2002 is changed by adjusting their activelengths. In this example, telescoping sleeves 2003 and 2004 areutilized. The upper portion 2005 has an upper substrate 2007, circuitry2009 to electrically connect the TE elements, and the upper sleeve 2003.The lower portion 2006 has the lower substrate 2008, circuitry 2009, andthe lower sleeve 2004. The TE elements 2002 are liquid or slurried TEmaterial that is confined within the low thermal conductivity,electrically insulative upper sleeve 2003 and lower sleeve 2004. A sealis formed between the outer surface of the upper sleeve 2003 and theinner surface of the lower sleeve 2004. An actuator 2010 (represented bythe arrow) moves the lower portion 2006 toward (decreasing TE elementlengths and therefore resistance) or away from the upper portion 2005that is stationary in this example.

FIG. 20B shows a portion of a TE element array 2031 constructed withsubstrates 2007 and 2008, liquid or slurried TE material 2002, circuitry2009, a pump 2034, and a pressure control valve 2035. In FIG. 20B, thetelescoping sleeves (of the device in FIG. 20A) are replaced withelastomeric tubes 2033 that are deformed under the action of the pump2034 and the pressure control valve 2035. As the pressure is adjustedupward the sleeves 2033 bulge, thereby increasing the cross-sectionalarea of the TE elements 2002 thus decreasing their electricalresistance. This in turn can change the efficiency, thermal powertransfer, and fluid flow in the TE system 2031.

FIG. 20C shows a portion of a TE element array 2041 with a composite,flexible sleeve 2043 that deforms outward from the tube interior whensubjected to an axial, compressive deflection load applied by actuator2010. In FIG. 20C, only one end of the lower substrate 2008 and itscircuitry 2009 moves so as to change the length and cross-sectional areaof the rightmost TE elements 2002 more than those at the left. Thischanges the resistance of all but the leftmost element and does so in anapproximately linear fashion.

FIG. 20D shows a portion of a TE element array 2051 constructed likethat of FIG. 20C but which has a flexible substrate 2052, flexible lowercircuitry 2053, and a plurality of actuators 2010. The actuators 2010adjust the lengths of sectional areas of TE elements 2002 or of sectionsof TE elements either individually or as groups.

Many other designs that employ convection are possible. The goal is tohave the material to be cooled and/or heated able to convect efficientlythe thermal power generated to enhance the operation of that side.Generally, to increase efficiency, the ratio of convection toconduction, δ, should be as large as is allowed by the available thermalpower produced. Current and TE geometry are adjusted to meet designneeds of both initial cost and operating costs. Solids, liquids andgasses can be used alone, or in combination to transport the thermalpower.

The concepts and designs that were discussed in the context of heatingapply to cooling as well. In many designs the same device can be used inboth the cooling and heating mode with very little, if any, physicalchange to the system. For example, the modified CCS system presented inFIG. 18 could be used in both heating and cooling mode by adjustingcurrent flow and direction and varying fan speed.

To optimize overall performance operation in both cooling and heating,design tradeoffs are made and it is advantageous to allow materialmovement or fluid rates to vary, along with current, and independently,with the proportions of flow to the cold and hot sides.

It should be noted that the N- and P-type TE elements are made up of TEmaterials that have been drawn equal in size and shape. However, theyneed not be equal in size and shape to achieve optimum efficiency. Thepreferred requirement for efficient functionality is that;

$\begin{matrix}{\frac{L_{n}A_{p}}{L_{p}A_{n}} = \left( \frac{\rho_{p}\lambda_{n}}{\rho_{n}\lambda_{p}} \right)} & (31)\end{matrix}$where;

L=TE element length

A=TE element cross sectional area

ρ=material electrical resistivity

λ=material thermal conductivity

For optimum efficiency, Equation 31 should be satisfied, and thegeometry should deliver the required thermal power. The shape of the Pand N elements can differ to achieve other design purposes. For example,only the P element could be liquid and convect thermal power, oralternately, only the N elements could be porous. Generally, systemefficiency is compromised if not all elements use convection butefficiency gains over conventional systems would still be obtained.Considerations such as cost, material availability, etc. would dictateappropriate design choices and final configuration.

Where the TE material itself moves and thereby transports its thermalpower, the thermal differences (thermal lags) that arise when thermalpower transfers from one part to another are eliminated. Such lags tendto reduce efficiency unless there is a corresponding gain to some otherpart of the system.

As mentioned above, several different embodiments and configurations inaccordance with the present invention have been described above. Theembodiments are intended to be exemplary rather than restrictive.Variations and combinations of the above embodiments may be made withoutdeparting from the invention. Accordingly, the invention is defined bythe following claims and their equivalents.

1. A thermoelectric power generator comprising: a plurality ofthermoelectric elements forming at least one thermoelectric array withat least one first side and at least one second side exhibiting atemperature gradient between them during operation, at least a portionof the at least one thermoelectric array is configured to permitgenerally steady-state convective heat transport toward at least oneside of at least a portion of the thermoelectric array, wherein at leastone convective medium flows at least one of inside, outside and throughat least a portion of the thermoelectric array, receives heat from thethermoelectric elements, and convects thermal power through the array,further wherein the thermoelectric power generator is fluidlyconnectable to either at least one co-generator or heating or coolingsystem configured to use the thermal power.
 2. The thermoelectric powergenerator of claim 1, wherein at least a portion of the at least oneconvective medium is recycled again through the thermoelectric powergenerator.
 3. The thermoelectric power generator of claim 2, wherein theat least one convective medium is cooled before the at least oneconvective medium is recycled again through the thermoelectric powergenerator.
 4. The thermoelectric power generator of claim 1, wherein thereceived heat causes a phase change of at least a portion of the atleast one convective medium.
 5. The thermoelectric power generator ofclaim 1, wherein the at least one convective medium comprises a liquid,wherein the liquid exits the thermoelectric power generator andtransports the thermal power away from the thermoelectric powergenerator.
 6. The thermoelectric power generator of claim 1, wherein theat least one convective medium comprises an inert fluid.
 7. Thethermoelectric power generator of claim 1, wherein the at least oneconvective medium is a working fluid in the at least one co-generator orheating or cooling system.
 8. The thermoelectric power generator ofclaim 1, wherein the at least one convective medium flows through atleast a portion of the array to provide the generally steady-stateconvective heat transport, wherein the at least one convective mediumflows generally from the at least one first side to the at least onesecond side.
 9. The thermoelectric power generator of claim 1, whereinat least some of the thermoelectric elements are permeable.
 10. Thethermoelectric power generator of claim 1, wherein at least a portion ofthe array comprises at least one heat transfer feature that improvesheat transfer between at least some of the convective medium and atleast a portion of the at least one thermoelectric array.
 11. Thethermoelectric power generator of claim 1, wherein a first plurality ofthermoelectric elements is configured for heat transport of a first typeand a second plurality of thermoelectric elements is configured forconvective heat transport of a second type.
 12. The thermoelectric powergenerator of claim 1, wherein at least part of the at least oneconvective medium is at least one thermoelectric material, saidconvective medium thermoelectric material also forming at least some ofthe thermoelectric elements.
 13. The thermoelectric power generator ofclaim 1, wherein at least one convective medium is a solid or a fluid.14. The thermoelectric power generator of claim 1, further comprisingthe at least one co-generator configured to use the thermal power. 15.The thermoelectric power generator of claim 1, further comprising the atleast one heating or cooling system configured to use the thermal power.16. A method of improving efficiency in a thermoelectric power generatorhaving a plurality of thermoelectric elements forming at least onethermoelectric array having at least one first side and at least onesecond side exhibiting at least one temperature gradient between themduring operation of the thermoelectric power generator through theintroduction of heat to the system, the method comprising: activelyconvecting thermal power through at least a portion of the array in agenerally steady-state manner with at least one convective medium,wherein the at least one convective medium flows at least one of inside,outside and through at least a portion of the thermoelectric array andreceives heat from the thermoelectric elements, further wherein thepower generator is fluidly connectable to either at least oneco-generator or heating or cooling system configured to use the thermalpower; and generating power from the at least one thermoelectric array.17. The method of claim 16, further comprising co-generating power atleast in part with the at least one convective medium.
 18. The method ofclaim 17, wherein co-generating comprises combusting at least a portionof the at least one convective medium in at least one co-generator. 19.The method of claim 17, wherein the step of co-generating comprisesexpansion of at least a portion of the at least one convective medium.20. The method of claim 17, further comprising heating or cooling atleast in part with the at least one convective medium.